Overbond launches “first” end-to-end platform for primary bond origination
Toronto-based Overbond, a bond issuance market provider, has launched an end-to-end platform and support framework for primary bond origination – the “first” fully-integrated platform to connect bond market issuers, dealers, and fixed-income investors.
The digital platform provides transparency, price discovery and investor diversification for all counterparties in the primary bond market, the firm says.
“We are the first fintech company focused on bringing the multi-trillion-dollar primary bond market closer to a completely digital approach,” says Vuk Magdelinic, co-founder and CEO of Overbond. “While much of the financial services market is embracing digital processes to streamline how they do business, primary bond origination remains one of the few asset classes that still relies on manual processes.”
The new digital platform also provides “secure” communications, real-time market updates, and custom reporting and analytics.
Earlier this year the company launched Overbond BPS, a solution for issuer-dealer communication and advanced market analytics.
Founded in 2015, the firm recently received $7.5-million in seed financing from Canada-based Morrison Financial Services.